Komi a ye dɛmɛfɛn ye min tɛ se ka bɔ bi, bi izinibaara la, die{0}}} kasɛti tigɛli be lɔyɔrɔba ta elekitoroniki, mobili, furakɛli, ani fɛnw labɛncogo la k’a sababu kɛ a ka baara tigitigi ye ani a be se ka la a la. A ka sɔngɔ jɔnjɔn be sɔrɔ a ka setigiya la ka baara kɛ ni cogoya kɛrɛnkɛrɛnninw ye ka tɛmɛ -Tilew fɛ, o be se ka kɛ sababu ye ka ɲɔgɔn lajɛn ka ɲɔgɔn kunbɛn.
Ka bɔ fɛɛrɛko la, disi- tigɛli kɛcogo jɔnjɔnw ye nɔrɔli basigi, minanw bɛnko, ani laminikogo kɛlɛli ye. Fɛɛn minw ka teli ka kɛ, olu ye PET (polisitɛri filimu) ye, ani non{2}}} fani min be se ka yɛlɛma, o min be bɛn ni nɛgɛ ye, a be yɛlɛma ani a be sɔgɔsɔgɔ, ani a be nɔrɔ ɲɔgɔn na cogo nɔgɔman na. Nɛgɛ sifa caaman be yen, i n’a fɔ akriliki, minw be yɔrɔ fɔlɔ ɲuman di, k’a sɔrɔ silikɔniw be se ka kɛ yɔrɔ minw na, u ka ca yɔrɔ minw na. Saga- tigɛli kɛcogo ka tiɲɛtigiya be nɔɔ to fɛɛn laban ka lajɛnni ɲuman kan. Bi laser dir - tigɛli fɛɛrɛ be se ka muɲu ±0.05mm, ka yɔrɔw nɔgɔya ani ka nɔrɔli to a la kontori gɛlɛnw kan.
Aplikasiyɔn hakɛ la, elekitoroniki baarakɛyɔrɔ ye suguba ye min be se ka di d-} ka kaseti ma. Misaliya la, smartphone ka lajɛn kɔnɔ, ultra-n filanin -se kasɛti be kɛ ka ekran nɔrɔ ɲɔgɔn na ni kaare ye, k’a sɔrɔ kasɛti minw be yɛlɛma yɛlɛma, olu be elekitoromansi don. Mobili dilanyɔrɔ la, tasuma-}retandant foam kasɛtiw be kɛ ka batiriw datugu, ni funteni yɛlɛmani ye -40 degere 150 ka se degere 150 ma. Dɔgɔtɔrɔya minanw na, silikoni minw be se ka farikolo yɔrɔw sɔgɔ, olu b’a to u be se ka jɛnɲɔgɔnya kɛ ni farikolo ye. Kɛrɛnkɛrɛnniya la, laminikogow be jii yiriwali lawuli ni fanga ye min basiginin be degun kan ani yɔrɔ minw be se ka tiɲɛ walisa ka RoHS ni REACH sariyaw labato.
Siniɲɛsigi la, ni ɛlɛkitoroniki fɛnw ka caya ye ani yiracogo yɛlɛmayɛlɛmalenw, die- kasɛtiw bena yiriwa ka taga yɔrɔ fitininw na (<0.03mm) and higher precision. Furthermore, the widespread adoption of digital die-cutting systems will further improve production efficiency, enabling small-batch customized production through CAD/CAM integration. This collaborative evolution of materials and technologies will continue to provide critical support for high-end manufacturing.
